The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent electrical ground resulting in exceptional accuracy and repeatability for most wafer types.

The Proforma 300i system includes full remote control operating software and Ethernet network interface capability.